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| STPS2150 Power Schottky rectifier Main product characteristics IF(AV) VRRM Tj (max) VF(max) 2A 150 V 175 C 0.67 V Description 150 V Power Schottky rectifier are suited for switch mode power supplies on up to 24 V rails and high frequency converters. Packaged in SMA and Axial, this device is intended for use in consumer and computer applications like TV, STB, PC and DVD where low drop forward voltage is required to reduce power dissipation. SMA (JEDEC DO-214AC) STPS2150A DO-15 STPS2150 Features and benefits Negligible switching losses Low forward voltage drop for higher efficiency and extented battery life Low thermal resistance Surface mount miniature package Avalanche capability specified Order Codes Part Number STPS2150A STPS2150 STPS2150RL Marking 2150 STPS2150 STPS2150 Table 1. Symbol VRRM IF(RMS) IF(AV) IFSM PARM Tstg Tj 1. Absolute Ratings (limiting values) Parameter Repetitive peak reverse voltage RMS forward voltage Average forward current Surge non repetitive forward current Repetitive peak avalanche power Storage temperature range Maximum operating junction temperature(1) thermal runaway condition for a diode on its own heatsink Value 150 15 Unit V A A SMA DO-15 SMA DO-15 TL = 145 C = 0.5 TL = 130 C = 0.5 tp = 10 ms sinusoidal tp = 1 s Tj = 25 C 2 75 150 2400 -65 to + 175 175 A W C C dPtot 1 --------------- > ------------------------dTj Rth ( j - a ) May 2006 Rev 5 1/7 www.st.com 7 Characteristics STPS2150 1 Table 2. Symbol Rth(j-l) Characteristics Thermal resistance Parameter SMA Junction to lead Lead length = 10 mm DO-15 30 Value 20 C/W Unit Table 3. Symbol IR (1) Static electrical characteristics Parameter Reverse leakage current Tests conditions Tj = 25 C Tj = 125 C Tj = 25 C VR = VRRM Min. Typ 0.5 0.5 0.78 IF = 2 A 0.62 0.86 IF = 4 A 0.70 Max. 1.5 1.5 0.82 0.67 V 0.89 0.75 Unit A mA VF (2) Forward voltage drop Tj = 125 C Tj = 25 C Tj = 125 C 1. tp = 5 ms, < 2% 2. tp = 380 s, < 2% To evaluate the conduction losses use the following equation: P = 0.59 x IF(AV) + 0.04 IF2(RMS) Figure 1. Average forward power dissipation versus average forward current = 0.1 = 0.05 = 0.2 = 0.5 Figure 2. Average forward current versus ambient temperature ( = 0.5) PF(AV)(W) 1.6 1.4 1.2 2.2 2.0 IF(AV)(A) Rth(j-a)=Rth(j-I) SMA 1.8 DO-15 =1 1.0 0.8 1.6 1.4 1.2 1.0 Rth(j-a)=100C/W 0.6 0.4 0.2 0.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0.8 T 0.6 0.4 T IF(AV)(A) =tp/T 1.8 2.0 tp 2.2 0.2 0.0 0 =tp/T 25 tp 50 Tamb(C) 75 100 125 150 175 2/7 STPS2150 Characteristics Figure 3. Normalized avalanche power derating versus pulse duration Figure 4. Normalized avalanche power derating versus junction temperature PARM(tp) PARM(1s) 1 1.2 1 0.1 0.8 0.6 0.4 0.2 0.001 0.01 0.1 1 PARM(tp) PARM(25C) 0.01 tp(s) 10 100 1000 Tj(C) 0 25 50 75 100 125 150 Figure 5. Non repetitive surge peak forward current versus overload duration - maximum values (SMA) Figure 6. Non repetitive surge peak forward current versus overload duration - maximum values (DO-15) IM(A) 10 9 8 7 6 5 4 3 2 1 0 1.E-03 1.E-02 1.E-01 1.E+00 IM IM(A) 10 9 8 7 6 Ta=25C Ta=25C 5 4 Ta=75C Ta=75C 3 2 IM t Ta=125C Ta=125C t =0.5 t(s) 1 0 1.E-03 =0.5 t(s) 1.E-02 1.E-01 1.E+00 Figure 7. Relative variation of thermal impedance junction to ambient versus pulse duration - epoxy printed circuit board, eCu = 35 m, recommended pad layout (SMA) Figure 8. Relative variation of thermal impedance junction to ambient versus pulse duration (DO-15) Zth(j-a)/Rth(j-a) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 Single pulse = 0.2 = 0.1 = 0.5 Zth(j-a)/Rth(j-a) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 = 0.5 T 0.3 0.2 = 0.2 = 0.1 T tp(s) 1.E+00 1.E+01 =tp/T 1.E+02 tp 1.E+03 0.1 Single pulse tp(s) 1.E+01 =tp/T 1.E+02 tp 1.E+03 0.0 1.E-02 1.E-01 0.0 1.E-01 1.E+00 3/7 Characteristics STPS2150 Figure 9. Reverse leakage current versus reverse voltage applied (typical values) Figure 10. Junction capacitance versus reverse voltage applied (typical values) C(pF) 1000 F=1MHz VOSC=30mVRMS Tj=25C IR(A) 1.E+04 Tj=150C 1.E+03 Tj=125C 1.E+02 Tj=100C 1.E+01 Tj=75C Tj=50C 100 1.E+00 1.E-01 Tj=25C VR(V) 1.E-02 0 25 50 75 100 125 150 10 1 10 VR(V) 100 1000 Figure 11. Forward voltage drop versus Figure 12. Forward voltage drop versus forward current - maximum values, forward current - maximum values, high level low level IFM(A) 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 Tj=125C (typical values) Tj=25C (maximum values) Tj=125C (maximum values) IFM(A) 100 Tj=125C (maximum values) Tj=125C (typical values) Tj=25C (maximum values) 10 VFM(V) 1 0.0 0.2 0.4 0.6 0.8 VFM(V) 1.0 1.2 1.4 1.6 1.8 Figure 13. Thermal resistance junction to ambient versus copper surface under each lead - Epoxy printed circuit board FR4, eCu = 35 m (SMA) Rth(j-a)(C/W) 140 120 100 Figure 14. Thermal resistance versus lead length (DO-15) Rth(C/W) 120 Rth(j-a) 100 80 80 60 60 Rth(j-I) 40 40 20 20 SCu(cm) 0 0 1 2 3 4 5 0 5 10 Lleads(mm) 15 20 25 4/7 STPS2150 Package information 2 Package information Band shows cathode. Epoxy meets UL94, V0. Table 4. SMA Package dimensions DIMENSIONS E1 REF. Millimeters Min. Max. 2.03 0.20 1.65 0.41 5.60 4.60 2.95 1.60 Inches Min. 0.075 0.002 0.049 0.006 0.189 0.156 0.089 0.030 Max. 0.080 0.008 0.065 0.016 0.220 0.181 0.116 0.063 D A1 A2 b 1.90 0.05 1.25 0.15 4.80 3.95 2.25 0.75 E c A1 E E1 b C L A2 D L Figure 15. SMA Foot Print Dimensions (in mm) 1.87 1.75 1.87 1.67 5.49 Table 5. C DO-15 Package dimensions DIMENSIONS A C REF. Millimeters Min. Max. 6.75 3.53 31 0.88 Inches Min. Max. A B D B 6.05 2.95 26 0.71 0.238 0.266 0.116 0.139 1.024 1.220 0.028 0.035 C D In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 5/7 Ordering information STPS2150 3 Ordering information Ordering type STPS2150A STPS2150 STPS2150RL Marking 2150 STPS2150 STPS2150 Package SMA DO-15 DO-15 Weight 0.068 g 0.4 g 0.4 g Base qty 5000 2000 5000 Delivery mode Tape and reel Ammopack Tape and reel 4 Revision history Date Jul-2003 Aug-2004 31-May-2006 Revision 3A 4 5 Last update. SMA package dimensions update. Reference A1 max. changed from 2.70mm (0.106inc.) to 2.03mm (0.080). Reformatted to current standard. Added ECOPACK statement. Updated SMA footprint in Figure 15. Changed nF to pF in Figure 10. Description of Changes 6/7 STPS2150 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZE REPRESENTATIVE OF ST, ST PRODUCTS ARE NOT DESIGNED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS, WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2006 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 7/7 |
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